Content area

Abstract

IBM has confirmed speculation that it will soon roll out chips using silicon-on-insulator technology. Many are taken by surprise by how widespread IBM's use of this technology will be.

Details

Title
Rad-hard to volume MPU ready
Author
Fasca, Chad
Pages
2, 6
Publication year
1998
Publication date
Aug 10, 1998
Publisher
Reed Business Information, a division of Reed Elsevier, Inc.
Website
http://www.electronicnews.com/
ISSN
10616624
Source type
Trade Journal
Language of publication
English
ProQuest document ID
209717262
Copyright
Copyright Electronic News Aug 10, 1998