Content area
Abstract
Chemical and equipment vendors are working to reduce the cost of through-silicon via filling to ensure that it is not a cost-prohibitive roadblock to 3-D integration. Multi-step filling, in which each sub-step is optimized, could help to further reduce costs.
Details
Title
Optimized TSV Filling Processes Reduce Costs
Author
Keigler, Arthur; Liu, Zhen; Chiu, Johannes
Pages
19
Section
Features
Publication year
2009
Publication date
May 2009
Website
ISSN
01633767
Source type
Trade Journal
Language of publication
English
ProQuest document ID
209616151
Copyright
Copyright Reed Business Information, a division of Reed Elsevier, Inc. May 2009