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Texas Instruments (TI) has announced its next-generation 90- nanometer, or 0.09-micron, logic-manufacturing process technology, featuring transistors as small as 37 nm-a width 2,000 times smaller than the thickness of newsprint. With the ability to pack more than 400 million transistors on a single chip, TI's technology will drive cost-effective, system-on-a-chip solutions with high levels of performance and power savings for TI digital-signal processing, high- performance, application-specific integrated circuits and Sun Microsystems-designed UltraSPARC processor products. According to TI, the combination of copper, low-k dielectric material, the industry's highest SRAM density and TI's 37-nm transistor will advance TI's leading-edge DSP and Sun's UltraSPARC processor products in the 90- nm process.