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Abstract
The development of a high-voltage power semiconductor device puts forward higher requirements for its electrical insulation materials. In this paper, an epoxy/SiC nonlinear field-dependent conductivity (FDC) coating material was reported to relieve its thermo-mechanical stresses during device operation. It was exciting that the coating could improve both partial discharge performance and insulation reliability for high-voltage power device packaging. This coating technology can improve the partial discharge inception voltage (PDIV) of power devices by a maximum of more than 86.2%. Based on the thermal shocking test, the PDIV of the device still exceeds 10 kV even after 1000 cycles. It was believed that the FDC insulation capable of forming a thin coating could be suitable for high-voltage power device packaging with good reliability because of reducing thermo-mechanical stresses greatly.
Details
1 Tianjin University, School of Materials Science and Engineering, Tianjin, China (GRID:grid.33763.32) (ISNI:0000 0004 1761 2484)
2 Tiangong University, School of Electrical Engineering, Tianjin, China (GRID:grid.410561.7) (ISNI:0000 0001 0169 5113)
3 Virginia Tech, Center for Power Electronics Systems, Bradley Department of Electrical and Computer Engineering, and the Department of Materials Science and Engineering, Blacksburg, USA (GRID:grid.438526.e) (ISNI:0000 0001 0694 4940)