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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

This research aims to optimize the efficiency of the device structures by introducing the novel double perovskite absorber layer (PAL). The perovskite solar cell (PSC) has higher efficiency with both lead perovskite (PVK), i.e., methylammonium tin iodide (MASnI3) and Caseium tin germanium iodide (CsSnGeI3). The current simulation uses Spiro-OMeTAD as the hole transport layer (HTL) and TiO2 as an electron transport layer (ETL) to sandwich the PVK layers of MASnI3 and CsSnGeI3, which have precise bandgaps of 1.3 eV and 1.5 eV. The exclusive results of the precise modeling technique for organic/inorganic PVK-based photovoltaic solar cells under the illumination of AM1.5 for distinctive device architectures are shown in the present work. Influence of defect density (DD) is also considered during simulation that revealed the best PSC parameters with JSC of 31.41 mA/cm2, VOC of 1.215 V, FF of nearly 82.62% and the highest efficiency of 31.53% at the combined DD of 1.0 × 1014 cm−3. The influence of temperature on device performance, which showed a reduction in PV parameters at elevated temperature, is also evaluated. A steeper temperature gradient with an average efficiency of −0.0265%/K for the optimized PSC is observed. The novel grading technique helps in achieving efficiency of more than 31% for the optimized device. As a result of the detailed examination of the total DD and temperature dependency of the simulated device, structures are also studied simultaneously.

Details

Title
Performance Improvement of Perovskite Solar Cell Design with Double Active Layer to Achieve an Efficiency of over 31%
Author
Bhattarai, Sagar 1 ; Mohammed, Mustafa K A 2   VIAFID ORCID Logo  ; Madan, Jaya 3   VIAFID ORCID Logo  ; Pandey, Rahul 3   VIAFID ORCID Logo  ; Mohd Zahid Ansari 4   VIAFID ORCID Logo  ; Zaki Rashed, Ahmed Nabih 5   VIAFID ORCID Logo  ; Amami, Mongi 6 ; M Khalid Hossain 7   VIAFID ORCID Logo 

 Technology Innovation and Development Foundation, Indian Institute of Technology Guwahati, Guwahati 781039, Assam, India; Department of Physics, Arunachal University of Studies, Namsai 792103, Arunachal Pradesh, India 
 College of Engineering, University of Warith Al-Anbiyaa, Karbala 56001, Iraq; [email protected] 
 VLSI Centre of Excellence, Chitkara University Institute of Engineering and Technology, Chitkara University, Rajpura 140401, Punjab, India 
 School of Materials Science and Engineering, Yeungnam University, 280 Daehak-Ro, Gyeongsan 38541, Gyeongbuk, Republic of Korea; [email protected] 
 Department of Electronics and Electrical Communications Engineering, Menoufia University, Menouf 32951, Egypt; [email protected]; Department of VLSI Microelectronics, Institute of Electronics and Communication Engineering, Saveetha School of Engineering, Saveetha Institute of Medical and Technical Sciences (SIMATS), Chennai 602105, Tamil Nadu, India 
 Department of Chemistry, College of Sciences, King Khalid University, Abha P.O. Box 9004, Saudi Arabia 
 Institute of Electronics, Atomic Energy Research Establishment, Bangladesh Atomic Energy Commission, Dhaka 1349, Bangladesh; Department of Advanced Energy Engineering Science, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Fukuoka 816-8580, Japan 
First page
13955
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
20711050
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2869677679
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.