Full Text

Turn on search term navigation

© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

A low-loss, compact, ultra-thin, passive, 77 GHz, 8 × 8 microstrip Butler matrix on a 200 μm thick high-purity fused-silica (HPFS) glass substrate embedded in 0.8 μm thick patterned gold conducting layers was developed for low power automotive radars. The first-of-its-kind, HPFS, glass-based Butler matrix comprised 12 hybrid couplers, 16 crossovers, and 8 phase shifters in a footprint area of 19.1 mm × 26.6 mm. The device and the corresponding building blocks were designed and optimized using 3D electromagnetic finite element method (FEM) simulations using the Advanced Design System (ADS) from Keysight™ Technologies. Due to the very-low-loss tangent of the HPFS glass substrate (0.0005 @77 GHz) compared to other common substrate materials and rigorous design optimization, the return loss and isolation of the input ports are both below −20 dB, respectively, as verified by 3D FEM simulations. Due to the absence of any published data on a 77 GHz 8 × 8 Butler matrix, the design was validated by developing a 4 × 4 version of the Butler matrix using the same building blocks and comparing the 3D simulation results in ADS with results published elsewhere that showed that the developed Butler matrix offers lower insertion loss in a 10% smaller footprint area. A low-cost microfabrication method has been developed to fabricate the devices using a standard lift-off process. A scaled version of the device can be used for 5G beamforming applications.

Details

Title
A Low-Loss, 77 GHz, 8 × 8 Microstrip Butler Matrix on a High-Purity Fused-Silica (HPFS) Glass Substrate
Author
Sakhiya, Ronak  VIAFID ORCID Logo  ; Chowdhury, Sazzadur
First page
1418
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
14248220
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2774970282
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.