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TMS Divisions Announce 2018 JOM, JEM Best Paper Award Recipients
The TMS Light Metals Division (LMD) and Structural Materials Division (SMD) will present their 2018 JOM Best Paper Awards during their respective division luncheons at the TMS 2018 Annual Meeting & Exhibition (TMS2018), March 11-March 15, in Phoenix, Arizona. The JOM Best Paper Awards recognize the excellence of papers published in the preceding year's volume of JOM that exemplify the application of science in solving a practical problem in either a light metals or structural materials related technical topic.
The recipients of the 2018 LMD JOM Best Paper Award are Alexei Vinogradov, Norwegian University of Science & Technology, Trondheim, Norway, and Kristian Máthis, Charles University, Prague, Czech Republic, for "Acoustic Emission as a Tool for Exploring Deformation Mechanisms in Magnesium and Its Alloys In Situ" published in the December 2016 JOM. In the article, the authors review the capacity of the advanced acoustic emission (AE) technique to understand the interplay between two primary deformation mechanisms-dislocation slip and twinning-in real time scale.
The 2018 SMD JOM Best Paper Award goes to Sudhanshu S. Singh, Indian Institute of Technology Kanpur, India, Tyler J. Stannard and Nikhilesh Chawla, both from Arizona State University, Tempe, Arizona, USA, and Xianghui Xiao, Argonne National Laboratory, Lemont, Illinois, USA. Their August 2017 paper, "In Situ X-ray Microtomography of Stress Corrosion Cracking and Corrosion Fatigue in Aluminum Alloys," presented recent 4D studies on stress corrosion cracking and corrosion-fatigue behavior of Al7075 alloys using x-ray synchrotron tomography.
The TMS Functional Materials Division (FMD) will also recognize the 2018 JEM Best Paper Award recipients for outstanding contributions to the Journal of Electronic Materials (JEM) at the FMD Council meeting held during TMS2018. Si Chen, Tong An, Fei Qin, Beijing, and Pei Chen, all from Beijing University of Technology, China, received the award for "Microstructure Evolution and Protrusion of Electroplated Cu-Filled ThroughSilicon Vias Subjected to Thermal Cyclic Loading", published in the October 17 issue of JEM. In this work, thermal cycling tests were carried out to identify how microstructure affects protrusion during thermal cycling.
The 2018 JOM and JEM Best Paper articles are available for free download to TMS members. Log in to www.tms.org/journals to gain free electronic access to JOM and JEM, as well as...