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COLUMBUS, OH The 2009 TAPPI PLACE Flexible Packaging Summit(Polymers, Laminations, Adhesives, Coatings and Extrusions) will beheld April 28-30, 2009, in Columbus, OH. The event will include thetwo-day Consumer Packaging Solutions for Barrier Performance Courseand the Symposium on Nanomaterials for Flexible Packaging.
Registration is encouraged before March 28, 2009, to savehundreds of dollars off the full-price fee. TAPPI members receivepreferential pricing for all registration...